Keywords thermal analysis, thermal models, board analysis, libraries, design environment
Start Date: 01-NOV-1993 / Duration: 36 months
[ contact / participants ]
The accurate prediction of the temperature of critical electronic parts at the component, board and system level is seriously hampered by the lack of reliable standardised input data. It is this deficiency which DELPHI principally seeks to address.
DELPHI is concerned with the creation and validation of thermal models of electronic parts such as IC packages, transformers, electrolytic capacitors, heat sinks and interfacing materials. The models will be integrated with commercial CAD tools for use in thermal analysis at all packaging levels, and will be provided to component suppliers and industrial end users.
The results will be adopted by the industrial partners. A further goal is the adoption of the DELPHI model by component suppliers. Attendance and contribution to appropriate standardisation committees has therefore high priority.
Generic thermal models will be provided for the important element types, and models for concrete component instances can be generated by setting the parameters (eg pin count) in the generic model.
In the first phase of the project, suitable methodologies for the creation of thermal models will be investigated and selected, together with consistent measurement and validation procedures. The generic models developed in the project will be validated against measurements for a sufficient variety of component instances.
Kingsgate Business Centre
12-50 Kingsgate Road
UK - Kingston-on-Thames KT2 5AA
tel: +44-81-547 3373
fax: +44-81-547 2682
FLOMERICS LIMITED - UK - C
ALCATEL BELL - B - P
ALCATEL ESPACE - F - P
RESEARCH CENTRE - IRL - P
PHILIPS CFT - NL - P
THOMSON-CSF - F - P
DELPHI - 9197, December 1993
please address enquiries to the ESPRIT Information Desk
html version of synopsis by Nick Cook