Design and Technology Methodology for ASIS Cells


DEMAC - 8756

Keywords ASIS, microsystems, integrated sensor systems, libraries, SMEs


Start Date: 01-DEC-1993 / Duration: 36 months

[ contact / participants ]


Objectives and Approach

DEMAC intends to provide SME system designers with a design and fabrication methodology for application specific integrated sensor systems (ASIS) comprising sensors as well as on-chip signal processing. ASIS have a broad market potential, but access for SMEs is still limited through non-industrial technological steps and a lack of standardised design and fabrication procedures. Similar to the semi-custom approach for integrated circuits (ICs), DEMAC will allow the ASIS designer to work on behavioural and electrical levels, where specific manufacturing requirements are hidden. The DEMAC process technology, on the other hand, will lead to lower system size and production cost, at increased functionality and reliability compared to conventional solutions.

The DEMAC approach is characterised by the following elements:

Microsystems packaging depends strongly on the final application and is outside the scope of the project. Packaging solutions based on available technologies, however, will be demonstrated for each sensor type.


CONTACT POINT

Dr. Joan Bausells
CENTRO NACIONAL DE
MICROELECTRONICA
Campus UAB
E - 08193 Bellaterra (Barcelona)
tel: +34-3-580 26 25
fax:: +34-3-580 14 96
email: bausells@cnm.es

Participants

CENTRO NACIONAL DE
MICROELECTRONICA (CNM) - E - C
COPRECI S. COOP. LTDA (FAGOR
SENSORES) - E - P
EUROPEAN SILICON STRUCTURES (ES2) - F - P
ETH ZUERICH - CH - P
UNIVERSITAT BARCELONA - E - A


TCS synopses home page TCS acronym index TCS number index
All synopses home page all acronyms index all numbers index

DEMAC - 8756, December 1993


please address enquiries to the ESPRIT Information Desk

html version of synopsis by Nick Cook