Standardised Packaging and Interconnect for Inter- and Intra-board Optical Interconnections


SPIBOC - 8679

Keywords optical interconnects, optoelectronics, interconnects


Start Date: 15-NOV-93 / Duration: 36 months

[ contact / participants ]


Objectives and Approach

The SPIBOC project will develop a set of components for multi-channel optical interconnection of racks, backplanes and on board components. Emphasis is placed on making a small, standardised and consistent set designed for easy use and cost-effective production, which is expected to lead to their early adoption by a variety of users in a wide range of applications requiring multi-gigabit per second inter-connections.

The project partners themselves form a representative group of users within the telecommunications and computer industry giving a good base line for developing the standards. As it is the intention to ensure broad acceptance of the standards defined, it is essential that input on the specification be obtained from and information on our activities and intention be spread to a larger group than is practical to have as partners in an ESPRIT project. The project will therefore establish a semi-open user group within which organisations outside the project consortium will participate by providing inputs on requirements.

The components will be developed in two phases corresponding to differing levels of maturity and integration of components.

For the Level 1 component set, existing or fairly mature components will be integrated into appropriate modules/subsystems using optoelectronic multichip module technology. This technology will be enhanced to achieve the data rates and environmental requirements necessary in practical systems and the standardised connector options developed. Appropriate ribbon fibre terminations and plastic-embedded ribbon fibre matrixes will be developed as the optical pathways for board and backplane level interconnect. This level will be sufficient where moderate numbers of modules are required per board (for example, where the total interconnect bandwidth required up to about 100 GBit/s), and all connections are point to point. This covers many applications envisaged for the 1995/6 time scale onwards.

For the Level 2 component set, the feasability of fully integrated optical connectors and subsystems allowing simultaneous optical and electrical connection to boards (plug-in electro-optic modules) and a factory-definable waveguide pattern integrated with the PCB forming either the backplane or board will be investigated. These more advanced products will be essential for more complex systems. Components from the two levels will interwork so that the system designer can take a "mix and match" approach to their inclusion in a given design.

To provide early hands-on testing of the design and of the applicability of the emerging standards, they will be incorporated into a massively parallel database server. An existing design will be used as a starting point, which will be modified to take advantage of the high capacity interconnection available from the components to be developed. This will provide an early demonstration of a significant performance improvement in a real application.


CONTACT POINT

Mr James Parker
BNR Europe
Optical Materials and Components
London Road
UK - Harlow CM17 9NA
tel: + 44/ 279-40 36 40
fax: + 44/ 279-44 15 51

Participants

BNR EUROPE - UK - C
BRITISH TELECOMMUNICATIONS - UK - P
BULL SA - F - P
ETH - CH - P
EUROPTICS LTD - UK - P
GRASEBY MICROSYSTEMS LTD - D - P
IMC - S - P
ERICSSON - S - P
PHILIPS BV - NL - P
TELEFONICA I+D - E - P
WHITE CROSS ADVANCED PRODUCTS - UK - P


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SPIBOC - 8679, December 1993


please address enquiries to the ESPRIT Information Desk

html version of synopsis by Nick Cook