Manufacturing Science and Technology for IC Production


MST III - 8003

Keywords VLSI manufacturing, wafer fabrication, process integration, clean room technology, masks, 0.5 micron CMOS, packaging, automation


Start Date: 01-APR-94 / Duration: 12 months

[ contact / participants ]


Objectives and Approach

For competitive manufacturing of advanced microelectronics, where technology lifetimes are comparatively short, it is essential to economise production techniques so that a cost-effective manufacturing capability is in place for the market's peak. In the MST project, the goal of the principal European IC manufacturer is to economise 0.5 micron process technologies in advance of this event.

See project 7365 for more details.


CONTACT POINT

Dr J. Griessing
SIEMENS AG
Balanstr. 73
D - 81541 MÜNCHEN
tel: + 49/ 89-4144-8382
fax: + 49/ 89-4144-8002
telex: 521080

Participants

SIEMENS AG - D - C
EUROPEAN SILICON STRUCTURES SA
(ES2 SA) - F - P
MIETEC NV - B - P
TELEFUNKEN ELECTRONIK GMBH - D - P
SGS-THOMSON MICROELECTRONICS SA - F - P
PLESSEY SEMICONDUCTORS LTD - UK - P
PHILIPS INTERNATIONAL BV - NL - P
MATRA-MHS - F - P


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MST III - 8003, December 1993


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html version of synopsis by Nick Cook