Manufacturing Science and Technology for Front-End and Back-End IC Production


MST-IC - 7365

Keywords VLSI manufacturing, wafer fabrication, process integration, cleanroom technology, masks, 0.7 micron CMOS 0.5 micron CMOS, packaging, automation


Start Date: 01-APR-92 (project 7365), 01-APR-94 (project 8003) / Duration: 24 months (project 7365), 12 months (project 8003)

[ contact / participants ]


Objectives and Approach

For competitive manufacturing of advanced microelectronics, where technology lifetimes are comparatively short, it is essential to economise the production techniques such that cost effective manufacturing is achieved in time for the market peak.

In this project the collaborative development work of eight European IC manufacturers is directed towards methods for the economic production of sub-micron silicon ICs. MST builds on the results of project 5081 (MST), which was the start-up phase of a joint European undertaking providing the manufacturing tools and methods to enable IC manufacturers to meet the requirements of process performance, manufacturing flexibility and cost.

The work includes the development and prototyping of concepts for advance manufacturing skills, and the optimisation and integration of industrial techniques needed for the cost-effective manufacture of high-technology components. The extensive workplan consists of four subprojects, each separated into two to five themes, with up to nine work-packages covering front- and back-end equipment engineering, automation/integration, and mask-making. Advances in the project will be related to improvements in cycle-time, productivity, probe yield, quality of process control, and cost.

Progress and Results

A significant benefit can be seen in the results where it is clear that the collaboration between the IC manufactures is accelerating the adoption of advanced manufacturing techniques. The results of the project work - conceptual and practical solutions to a multitude of manufacturing problems - have been compiled into a deliverables list with hundreds of titles. These reports have been disseminated amongst the consortium partners. European equipment and materials representatives can get access to the relevant reports, and thus industry at large will gain from the project.

Other spin offs from the partners include major contributions to standards, where project results are being taken forward to be incorporated in international industrial standards. Topics include procurement specifications, the functional model of a flexible manufacturing cell controller, and a standard test reticle design for correlation and assessment purposes.

As the strategic roadmaps of the project have taken form in the various subprojects, the body of work benefits not just the partners, but is also establishing links to many other JESSI and Community funded projects providing a manufacturing perspective, and helping to indicate cohesive direction for European microelectronics manufacturing tools and automation/integration topics. The principle work of 7365 is to take the 0.7 micron CMOS technology developed in Joint Logic (7363) into an economised manufacturing activity at the end of 1993. The principle goal of 8003 starting in 1994 is to qualify the 0.5 micron process for production ahead of market peak.


CONTACT POINT

Mr J. Griessing
Siemens AG
Balanstr. 73
D - 81739 München
tel: + 49 / 89-4144-8382
fax: + 49 / 89-4144-8002
telex: 521080

Participants

SIEMENS AG - D - C
EUROPEAN SILICON
STRUCTURES SA (ES2 SA) - F - P
ALCATEL MIETEC NV - B - P
TEMIC TELEFUNKEN
MICROELECTRONIC GMBH - D - P
SGS-THOMSON MICROELECTRONICS SA - F - P
GEC-PLESSEY SEMICONDUCTORS LTD - UK - P
PHILIPS SEMICONDUCTORS BV - NL - P
MATRA-MHS - F - P

IBM - F - A


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MST-IC - 7365, December 1993


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html version of synopsis by Nick Cook