Application Modular Integrated Sensors


AMIS - 6505

Keywords integrated sensors


Start Date: 01-APR-92 / Duration: 36 months

[ contact / participants ]


Objectives

The objective of AMIS is to develop silicon integrated sensors of higher accuracy, greater reliability and lower cost than current non-integrated sensor systems.

The market sectors addressed by the project are automotive, medical and consumer. These markets will receive a major impetus when high sensor integration level is matched with low cost, as has been the case in the IC field.

A modular approach will be adopted, parallel to that of ASICs, reducing development costs and enabling fast prototyping. This approach will appeal to all application areas, but will especially suit the needs of SMEs.

The main technical issues to be addressed include techniques for encapsulation at the wafer level, silicon-silicon fusion bonding, bulk and surface micromachining techniques, and compatibility between the sensor manufacturing and CMOS processes. Compatibility between the various requirements of the sensors and their microelectronic interface circuits will also be considered. Other critical issues to be tackled during the project include packaging, simulation tools and testing.

Progress and Results

Three hybrid sensors (mock-ups) have been specified and designed using a modular approach.


CONTACT POINT

Dr J. P. Rouet
SAGEM
Le Ponant
27 rue Leblanc
F - 75512 Paris Cedex 15
tel: + 33 / 1-4070-6296
fax: + 33 / 1-4070-6678
telex: 608875

Participants

SAGEM - F - C
CEA - F - P
ELMOS GMBH - D - P
STERIMED - D - P
MEDISPO MEDISINTECHNIK - D - A
ESIE - F - A
CNRS-LAAS - F - A
FRAUNHOFER-IMS - D - A


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AMIS - 6505, December 1993


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html version of synopsis by Nick Cook