Three-Dimensional Modules Packaging


TRIMOD - 6490

Keywords TAB, 3-D packaging


Start Date: 01-JUL-92 / Duration: 24 months

[ contact / participants ]


Objectives

The TRIMOD project aims to develop a technology that allows very high packaging densities in electronic systems. In principle, the method consists of using epoxy to stack silicon dies (chips on tape), allowing input/output connections to be made on the sides of cubes created by machining with conventional silicon sawing equipment.

The main features of the proposed packaging technology are:

Progress and Results

Two RAM demonstrators are being manufactured (single block package and multi-block module applications), together with a further demonstrator in the form of the main components for a hand-held video communications system.

Functional samples of a 250 Mbit memory block are available, and a 768 Mbit DRAM is being processed. Yield reliability and manufacturing related issues are under further investigation. The technological developments are complemented by mechanical stress and thermal mechanical modelling.

Exploitation

The technology is being licensed to partners outside the consortium, and a process line for prototyping and small-volume production is being installed. The first prototypes of the 256 Mbit memory block are being offered to preferred customers.


CONTACT POINT

Mr C. Val
Thomson-CSF
Parc d'Activités Kleber
160, bd de Valmy, BP 82
F - 92704 Colombes Cedex
tel: + 33 / 1-4760-3545
fax: + 33 / 1-4760-3609
telex: 616780 THOM F

Participants

THOMSON-CSF - F - C
IMPLEX PLC - UK - P
ALCATEL ESPACE - F - P
NATIONAL MICROELECTRONICS
RESEARCH CENTRE - IRL - P
MBB GMBH - D - P
UNIVERSITY OF SHEFFIELD - UK - A


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TRIMOD - 6490, December 1993


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html version of synopsis by Nick Cook