Flexible Digital Signal Processor for Space and Industrial Applications


OMI/DIPSAP - 6347

Keywords DSP, space applications


Start Date: 01-JUL-92 / Duration: 12 months

[ contact / participants ]


Objectives

The DIPSAP project is targeted at providing a European sourced high-performance programmable Digital Signal Processor (DSP) which is designed to meet the stringent demands of the space environment, thereby placing Europe in the vanguard of an open world market. However, the scope of exploitation of the project results is extended into much wider markets by enhancing the DSP with additional functionality and interfaces to provide systems suitable for applications specific processing solutions in, for example, automotive and robotics industries. By performing the design activities under the umbrella of OMI, standards are established which will allow future developments in microelectronics to be incorporated without the need for expensive redesign stages.

The DIPSAP-I project represents the feasibility phase of a longer term project. Under the feasibility phase, major technical (performance requirements, application constraints, interface requirements), production (component and process availability, software support, risks) and commercial (licensing, applications, market type and value) aspects are studied to assess the feasibility of developing a DSP for the above applications.

Progress and Results

A clear requirement and unsatisfied market for DSP based processor units has been identified for the application areas being investigated in the DIPSAP study. Although the individual requirements for specific applications are diverse, a common requirement for a 32-bit floating-point DSP device has been identified. The requirements have been grouped into two classes corresponding to moderate (<20 Mflops), mono DSP and high (>20 Mflops) multi DSP processing performance. Such a DSP device would also fulfil many of the requirements of neighbouring application areas (aeronautic, nuclear, etc).

The network system architecture and corresponding DSP processing elements are the presently preferred multi-processor solution. Communication links should be based on those being developed within the OMI/HIC project. A combination with a RISC processor such as the SMILE/SPARC processor is highly desirable. A good basis tool to support simulation of data flow dominated processing architectures is the DSP Station.

The most attractive (technical, technological, commercial) candidate Digital Signal Processor has been identified. Licensing proposals are being evaluated.

It is important that the DSP device be available in the different technologies suited to the specific requirements and characteristics of the final markets (space, industrial, automotive): low-volume, high-price and radiation-hardened devices for space, and high-quantity low-price devices for industrial/automotive applications. Similar technology-independence requirements must be placed on any other OMI/Eurocell cells needed for a complete development.

Further information about DIPSAP is available from the DIPSAP home page.


CONTACT POINT

Mr Timothy Pike
Deutsche Aerospace
Postfach 801169
D - 81663 München
tel: + 49 / 89-607-29274
fax: + 49 / 89-607-28141
telex: 5287-0 DASAM D

Participants

DEUTSCHE AEROSPACE - D - C
TEMIC MBB-MIKROSYSTEME - D - P
THOMSON - CSF RGS - F - P
THOMSON-CSF SEMICONDUCTORS Specifiques - F - P


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OMI/DIPSAP - 6347, December 1993


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html version of synopsis by Nick Cook