Advanced Laser Reflow Soldering for Surface Mount Technology


ALERT - 6140

Keywords mechatronics, surface-mounted device assembly, PCB production


Start Date: 01-SEP-92 / Duration: 36 months

[ contact / participants ]


Objectives

The objective of ALERT is to develop the equipment and process required to produce printed circuit boards with surface-mounted devices (SMD) and fine pitch IC (integrated circuit) components with high-speed laser-soldering techniques. Picking, placing and soldering will be combined in one process step.

The approach will be based on:

The work will include the development of a CAD/CAM data interface, together with machine control and user interfaces.

Pilot demonstrations and evaluation are foreseen through a high-speed in-line application at Thomson.

The results will be applicable to the development of new laser-soldering placement machines, which will be marketed by a vendor consortium vendor.


CONTACT POINT

Mr S. Van Gastel
Nederlandse Philips Bedrijven BV
P.O.Box 218, Building SAN-2
NL - 5600 MD Eindhoven
tel: + 31/ 40-7 32106
fax: + 31/ 40-7 34384
telex: 3500 PHTC NL

Participants

NEDERLANDSE PHILIPS BEDRIJVEN BV - NL - C
SIAP SISTEMI - I - P
DEUTSCHE THOMSON-BRANDT GMBH - D - P
TECNOSPAZION S.P.A - I - P
UNIVERSITÄT ERLANGEN-NÜRNBERG - D - A -


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ALERT - 6140, December 1993


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html version of synopsis by Nick Cook