Keywords surface-mounted device assembly, SMEs
Start Date: 01-NOV-90 / Duration: 12 months
[ contact / participants ]
The aim of this action was to develop a specification for a yield improvement system for fine-pitch surface-mounted device (SMD) assembly, particularly in SMEs.
The consortium identified the state of the art and the definition of needs for fine-pitch surface mount assembly (SMA) within SMEs. The particular problems of fine-pitch SMA were studied, including soldering techniques, failure analysis and reliability evaluation. The testability of fine-pitch assemblies was also assessed.
The specification of the yield improvement system included designing the assembly for high yield, operator training and statistical process control.
Mr C. van Rossum
WELD-EQUIP Sales BV
PO Box 164
NL - 5700 AD HELMOND
tel: + 31/ 492-542225
fax: + 31/ 492-543230
WELD-EQUIP BV - NL - C
CSEA - I - P
VALTRONIC FRANCE SA - F - P
UNIVERSITY COLLEGE CORK - IRL - P
SMART - 5609, December 1993
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html version of synopsis by Nick Cook