Yield Control in SMD Assembly


SMART - 5609

Keywords surface-mounted device assembly, SMEs


Start Date: 01-NOV-90 / Duration: 12 months

[ contact / participants ]


Objectives

The aim of this action was to develop a specification for a yield improvement system for fine-pitch surface-mounted device (SMD) assembly, particularly in SMEs.

The consortium identified the state of the art and the definition of needs for fine-pitch surface mount assembly (SMA) within SMEs. The particular problems of fine-pitch SMA were studied, including soldering techniques, failure analysis and reliability evaluation. The testability of fine-pitch assemblies was also assessed.

The specification of the yield improvement system included designing the assembly for high yield, operator training and statistical process control.


CONTACT POINT

Mr C. van Rossum
WELD-EQUIP Sales BV
Engelseweg 217
PO Box 164
NL - 5700 AD HELMOND
tel: + 31/ 492-542225
fax: + 31/ 492-543230
email: info@weld-equip.com

Participants

WELD-EQUIP BV - NL - C
CSEA - I - P
VALTRONIC FRANCE SA - F - P
UNIVERSITY COLLEGE CORK - IRL - P


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SMART - 5609, December 1993


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html version of synopsis by Nick Cook