Keywords multichamber, process integration, open architecture
Start Date: 15-APR-90 / Duration: 36 months
[ contact / participants ]
The main aim of PROMIMPS was to combine and integrate process steps required for sub-micron ASIC and memory device fabrication in CMOS, bipolar or BICMOS technology.
Using an already developed and tested multichamber equipment platform with up to nine separate process chambers, the integration of the following three multistep processes for the fabrication of multilayer interconnections has been accomplished:
In situ measurement and control of vacuum and process conditions (during the process) and an online examination (after the process) of deposited films lay within the scope of the project.
An important objective was to demonstrate the technological advantages of integrated processes and their cost-effectiveness, including yield and wafer cycle time considerations. Process integration demands process isolation, the cleanliness of the deposit, and a high vacuum environment during transport between the process chambers. The standard equipment configuration is a single wafer processing, cassette-to-cassette fully automated system. Modules capable of performing one or more process steps are fitted to the central handling unit, allowing the integration of up to nine vacuum-isolated process steps.
The overall system aims at an open architecture with standardised mechanical and electrical interfaces compatible with MESA (Modular Electronic Standard Architecture), allowing the later integration of further process modules from a worldwide supplier base.
A multimetal sputter system was manufactured by Balzers, and, after successful acceptance tests, was shipped to Siemens for process development and qualification. The RPT module developed by AST has been integrated with the system. An in-situ salicide process could be successfully demonstrated under production conditions at Siemens. A comparison with ex-situ processing revealed significant advantage of the in-situ process in terms of lot cycle times and cost of ownership. AST has demonstrated their capabilities as a competent supplier of RTP modules for cluster tools.
The prototype module for W-CVD was developed in collaboration between Balzers and LETI and was installed at the latter, where functional testing had been carried out successfully.
The PECVD module was completed at Plasmos, fitted to a Balzers clusterline, and was evaluated on site with the help of Siemens. Most of the technical data achieved met the specifications for the reactor hardware. First depositions of SIO2 in a PECVD module using a horizontal gas flow concept and TEOS/O2 or TEOS/O3 gas mixtures showed that films are stoichiometric and that deposition rate as well as thickness uniformity still have to be improved.
The significant amount of experience gained, especially by AST, PLASMOS and Siemens in the final phase of the project, will be used directly in the companies. AST has improved the chances for PTP modules and will use the developed in-situ temperature control as well for their stand-alone equipment. PLASMOS will use the software solutions of project 5041 for their very successful ellipsometer.
The results of PROMIMPS will be partially used in the ongoing JESSI projects IVPS and E5.
Dr Peter Paduschek
Tegernseer Landstr. 161
D - 8000 MÜNCHEN 90
tel: + 49/ 89-697760
fax: + 49/ 89-6917004
PLASMOS GMBH - D - C
AST ELEKTRONIK GMBH - D - P
CSIC-CONSEJO SUPERIOR DE
INVESTIGACIONES CIENTIFICAS - E - P
CEA - F - P
SGS-THOMSON MICROELECTRONICS SRL - I - P
INFORMATIONSSYSTEME AG (SNI) - D - P
NEDERLANDSE PHILIPS BEDRIJVEN BV - NL - P
FRAUNHOFER IFT - D - P
BALZERS AG - FL - P
PROMIMPS - 5041, December 1993
please address enquiries to the ESPRIT Information Desk
html version of synopsis by Nick Cook