Keywords plasma etching, ULSI devices
Start Date: 15-DEC-88 / Duration: 36 months
[ contact / participants ]
The goal of this project was the development and evaluation, in an industrial environment, of two industrial prototype etchers capable of producing the new generation of Ultra Large Scale Integration (ULSI) devices.
ICARE aimed to develop a new generation of industrial etcher equipment based upon the use of one of the two new reactor concepts, both operating with resonant coupling: the Resonant Inductive Plasma Etching (RIPE), and the Distributed Electron Cyclotron Resonance (DECR). The main targeted characteristics of these reactors were:
Three types of etching processes specific to ULSI technology are to be developed to support this project: trench etching for isolation, contact and via etching, and fine-line polysilicon etching on thin gate oxide.
Two experimental reactors based on the two RIPE and DECR concepts have already been manufactured and evaluated.
The project was discontinued in June 1990.
Mr A. Durandet
55 rue Edgar Quinet
F - 92240 MALAKOFF
tel: + 33/ 1-40923136
fax: + 33/ 1-40920450
ALCATEL CIT - F - C
CEA-LETI - F - P
NEDERLANDSE PHILIPS BEDRIJVEN BV - NL - P
TRINITY COLLEGE DUBLIN - IRL - P
BNR EUROPE LTD - UK - P
CNM - E - P
CNET - F - P
ICARE - 2437, December 1993
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html version of synopsis by Nick Cook