ASIC Multichamber Rapid Thermal Processing with Microwave Enhancement


Project 2319

Keywords wafer fabrication, rapid thermal processing, multichambers


Start Date: 15-DEC-88 / Duration: 36 months

[ contact / participants ]


Objectives and Approach

The growing pressure on manufacturers to obtain high yields from their wafer fabrication operations is leading a trend towards single wafer processing. Rapid Thermal Processing (RTP) has come to be viewed as the single wafer alternative to furnace tube processing. The project aimed to develop a multichamber RTP machine with improved control of the on-wafer temperature and including novel microwave-enhanced techniques for precleaning before oxidation or deposition processes.

The principal technical tasks of this project involved:

Progress and Results

During the first year of the project, several results were demonstrated concerning:

Such equipment was expected to give high yields in high-temperature processes. Because of its greater flexibility, it is expected to be an important production tool for low-volume and fast-turnaround ASICs.

The project was discontinued in June 1990.


CONTACT POINT

Mr Alain Picard
SITESA ADDAX
ZI de Percevaliere
F - 38170 SEYSSINET-PARISET
tel: + 33/ 76 49 38 04
fax: + 33/ 76 96 55 69
telex: 308588

Participants

SITESA ADDAX - F - C
CNRS-LAAS - F - P
SGS-THOMSON MICROELECTRONICS SA - F - P
UNIVERSITY OF EDINBURGH - UK - P
BNR EUROPE LTD - UK - P
CEA - F - P


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Project 2319, December 1993


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html version of synopsis by Nick Cook