Keywords deep UV, resist, dry development
Start Date: 01-DEC-88 / Duration: 36 months
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The work covered by the DRYDEL project aimed to develop a deep-UV sensitive photoresist and the associated processing, with the objective of extending the DESIRE (Diffusion-Enhanced Silylating Resist) process down to the 0.3 micron range. The DESIRE process is a single-layer resist system based on surface imaging resulting from selective silylation and anisotropic dry development.
Resist materials were developed and variations of the various components of the resist (photoactive compound, resin composition and solvents) investigated. This led to an optimisation of the i-line version of the resist (for exposure at 365 nm) and to the fabrication of first samples of the deep-UV version (for exposure at 248 nm).
Resist processing, such as silylation, dry development and pattern transfer, was studied. As well as an optimisation of each processing step, more fundamental studies were carried out on silylation kinetics and swelling behaviour. Several new pieces of equipment were evaluated for silylation and dry development (including magnetically enhanced reactors and ECR). Using the optimised resist materials and processes, lithographic resolution down to 0.25 micron (lines/spaces) was demonstrated with perfect line-width control over highly reflective topography (on deep-UV stepper, lambda = 248 nm, NA = 0.42).
The various processes were installed and the resist technology demonstrated by fabricating test devices with geometries down to 0.35 micron, allowing an assessment of the yield of the lithographic process.
The feasibility of the DESIRE process for application in GaAs processing was also shown. The lift-off capabilities of the process were demonstrated by the fabrication of appropriate test circuits.
Mr L. van den Hove
B - 3030 LEUVEN
tel: + 32/ 16-281491
fax: + 32/ 16-229400
IMEC VZW - B - C
FARRAN TECHNOLOGY LTD - IRL - P
NEDERLANDSE PHILIPS BEDRIJVEN BV - NL - P
SIEMENS AG / SEMICONDUCTOR GROUP - D - P
UCB ELECTRONICS SA - B - P
PLESSEY COMPANY PLC - UK - P
CEA - F - P
DRYDEL - 2265, December 1993
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html version of synopsis by Nick Cook