Advanced Packaging for High Performance


APACHIP - 2075

Keywords TAB, VLSI, packaging


Start Date: 16-JAN-89 / Duration: 48 months

[ contact / participants ]


Objectives and Approach

The APACHIP project addressed the field of advanced VLSI packaging. It was aimed at providing advanced packaging solutions for multichip modules and for single chip package applications. The project developed packaging techniques for highly integrated bipolar circuits requiring liquid cooling, and also for the even more integrated MOS VLSIs, where air-cooling techniques can still be applied. VLSI chips, whether bipolar or MOS, are assembled using tape automated bonding (TAB). The necessary TAB tape was developed in the project and introduced to the European market.

The efficient interconnection of VLSI chips requires the availability of high-density high-performance substrates. Two different approaches of high-density substrate realisation were tackled in APACHIP. One proceeds from printed circuit board-like technology to achieve very dense interconnection and miniature laser-formed vias; the other approach uses thin film deposited and electrolytically reinforced copper lines separated by polyimide layers. This copper-polyimide structure is applied on a large ceramic substrate, also developed in the project. A new connector concept was defined to test the multichip or single chip substrates populated with TAB chips and to connect them into systems. Electrical modelling, reliability aspects and new inspection methods were also included in the project.

Progress and Results

The following results were achieved:

Exploitation

The marketable products generated by the project include packaged electronic sub-assemblies of electronic systems and also packaging material supplies (TAB tapes, ceramic packages, etc) necessary for an advanced European electronic industry.


CONTACT POINT

Mr Karel Kurzweil
BULL SA
Rue Jean Jaures
F - 78340 LES CLAYES-SOUS-BOIS
tel: + 33/ 1-30807000
fax: + 33/ 1-34627879
telex: 696054 BULLSA F

Participants

BULL SA - F - C
HOECHST CERAMTEC AG - D - P
NATIONAL MICROELECTRONICS
RESEARCH CENTRE - IRL - P
SOURIAU & CIE - F - P
TECHNISCHE UNIVERSITÄT BERLIN - D - P
SIEMENS-NIXDORF
INFORMATIONSSYSTEME AG (SNI) - D - P
MCTS - F - P
GEC RESEARCH LABORATORIES - UK - P


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APACHIP - 2075, December 1993


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html version of synopsis by Nick Cook