Automated Process and Assembly Inspection by 3-D Vision


TRIOS - 2017

Keywords vision systems, inspection systems


Start Date: 01-MAR-89 / Duration: 48 months

[ contact / participants ]


Objectives and Approach

The objective of this project is to develop a high-speed 3-D inspection system for the electronics industry.

Severe inspection problems are generated by the combination of the increasing miniaturisation of electronic components and assemblies, the increasing speed of their production, and ever-increasing demands for high quality. The aim of this project is to provide a solution based on high-speed, high-resolution 3-D sensing and data processing.

Progress and Results

In the first phase of the project, basic investigations have been undertaken on 3-D sensing, 3-D data processing and CAD/CAM support for inspection. These results are being used to specify and develop 3-D sensor devices, data-processing units, and CAD/CAM support software and interfaces.

The resulting hardware and software modules will be integrated and tested in two different applications:

The evaluation provided successful results in terms of inspection reliability speed and flexibility. The performance of the developed prototypes clearly exceed the state-of-the-art in this field. The first exploitation step will be given by the implementation within the project partners'own production lines. Further developments in terms of products and services are currently followed up.


CONTACT POINT

Dr Günter Doemens
SIEMENS AG
ZPL 1 FPS 4
Otto-Hahn-Ring 6
D - 81739 MÜNCHEN
tel: + 49/ 89-6364-8770
fax: + 49/ 89-6364-6192
telex: 5210911 SIE D

Participants

SIEMENS AG - D - C
DISEL SA - E - P
NEDERLANDSE PHILIPS BEDRIJVEN BV - NL - P
UNIVERSITÄT ERLANGEN-NÜRNBERG - D - P
ZENON SA - GR - P
SILICON & SOFTWARE SYSTEMS - IRL - P
ROBOTIKER - E - P


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TRIOS - 2017, December 1993


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html version of synopsis by Nick Cook